Endometrial Scratching

The endometrial scratch is known as the procedure applied to assist successful embryos implantation after In-Vitro Fertilization (IVF) or Intracytoplasmic Sperm Injection (ICSI) treatment. Couples, who have experienced multiple unsuccessful IVF cycles in the past, despite transferring good quality embryos mostly go for this procedure.

Pain Management in Uterus Scratching or Endometrial Scratching

Endometrial Scratching or Uterus Scratching is also referred to as an endometrial biopsy. The reason behind such terminology is that it involves taking a biopsy of the lining of the uterus, called the ‘endometrium’. The procedure includes a thin catheter (pipille), which is inserted through the cervix. The procedure does not require any anesthetic. However, over-the-counter pain medications are given to the patient to handle some pain. The endometrial biopsy is executed during hysteroscopy.

The procedure of endometrial scratch is executed in the first week or sometimes before the start of an IVF or frozen embryo transfer (FET) cycle (the luteal phase). As the ovulation is over and the woman’s period is due, fertility specialists perform endometrial scratch with specific guidance to irregular menstrual cycles.

Endometrial Scratching To Increase Chances of IVF Success

Endometrial scratching is highly beneficial in increasing the chance of pregnancy from IVF. Various research and clinical trials have proven this fact again and again in couples experiencing negative IVF in the past.

As per the European Society of Human Reproduction and Embryology (ESHRE), endometrial scratching increases the chance of pregnancy for every intended parent who is trying to conceive naturally or with Intrauterine Insemination (IUI). Various studies have validated this fact that the procedure has made a number of successful infertility treatments along with spontaneous conception.

How Endometrial Scratching Improves Pregnancy Rates

Endometrial scratching works as a repair reaction in the uterine lining of the body. Thus, the lining becomes more receptive to embryo implantation. This improves the implantation rate and as a consequence, the pregnancy chances also increase. Introduction of endometrial scratching in the IVF cycle has made it possible for many intended couples who have had negative results before. IVF sometimes leave you with no answer to “what went wrong” in the procedure. Implementation of advanced fertility techniques like endometrial scratching has made it easy for couples to achieve pregnancy with a more successful rate.

Fertility Specialists Recommend Endometrial Scratch

More fertility experts and specialists recommend endometrial scratching after a minimum of two unsuccessful IVF cycles. It is important for the intended parents to sit with the IVF consultant and develop a plan of treatment that does not allow repetition of a failed procedure. Even in case of healthy pregnancies, there are trials of negative IVF cycles in the past. Unless the uterine lining is properly optimized there can be genetically abnormal elements present in the IVF cycle which are not healthy enough for the baby to develop. Women with multiple failed IVF cycles before have most of their success rate with endometrial scratching.

When It Is All About the IVF Cycle Success

Endometrial scratching has proven to be beneficial in improving the implantation rate of a subsequent IVF cycle. It has played an important role in optimizing the uterine lining of a woman and developing it. This is one of the major reasons why women with previous failed IVF cycles have also experienced success after the introduction of endometrial scratching.

IVF is a long struggle for any intended parent. People are bought to IVF when they fail to conceive naturally. Even if they abide by all the guidance and instructions of the IVF consultant, there are instances when intended parents face failure in their IVF cycle. Endometrial scratching is a milestone in the field of IVF and surrogacy that has made it possible for many intended parents to finally conceive.